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SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
CMP equipment achieves global flattening of the wafer surface through the synergistic effect of chemical etching and mechanical grinding, removes excess materials (such as polysilicon, oxides, copper, etc.), and ensures the accuracy of subsequent lithography and deposition processes.
High-precision polishing: A combination of abrasive liquid and a rotating grinding disc is used to achieve nano-level flatness and surface finish. Multi-scenario adaptation: TSD's CMP equipment supports polishing of a variety of materials, including semiconductor substrates, advanced packaging, etc. Intelligent control: An integrated real-time monitoring system is used to optimize polishing parameters and reduce defects.
