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SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
Thinning machines are mainly used to reduce the thickness of wafers, usually through mechanical grinding or chemical etching processes, to meet the stringent requirements of chip packaging or 3D stacking processes on wafer thickness. For example, Heyan Technology's 12-inch fully automatic grinding and polishing machine is compatible with 8/12-inch wafers, supports back grinding and thinning processes, and is suitable for ultra-thin wafers (thinnest 50μm) Processing
Intelligent control: integrated sensors and machine vision algorithms to adjust cutting parameters in real time to ensure processing accuracy (±7μm). Automatic loading and unloading: The whole process is automated through the robotic arm and conveyor belt, which reduces manual intervention and improves efficiency. High-rigidity air-floating spindle: The C5 TSD thinning machine uses a high-power spindle, combined with a high-resolution thickness gauge, to ensure the stability of the grinding quality.
