English
SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
Product Features
High cleanliness: Purity > 99.5%, no impurity contamination, suitable for high-precision scenarios such as semiconductors.
Precise adsorption: extremely smooth surface (Ra≤0.05μm), uniform micropores (Φ20-50μm), adsorption force error < ±1.5%, no damage to workpieces.
Heat resistance: Resistant to -200 °C to 600 °C, with a thermal expansion coefficient close to that of silicon and minimal deformation at high temperatures.
Corrosion resistance: Resistant to strong acids, strong alkalis, and plasma, with a lifespan of over 1 million cycles.
High strength: Sintered at 1650 °C, hardness 1600Hv, impact resistance, strong sealing (extremely low leakage rate).
Insulation: Volume resistivity > 10¹⁴Ω·cm prevents micro-short circuits (such as wafer cutting).
Zero magnetic interference: Magnetic susceptibility < 1×10⁻⁶, suitable for magnetron sputtering, electron beam processing, and other magnetic field-sensitive scenarios.
Customizable: Supports shape, heating/anti-static function customization to fit multi-scenario requirements.
