SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
A horizontal online magnetron sputtering continuous coating system that prepares transparent conductive films through target sputtering and deposition, capable of simultaneous double-sided coating.
Equipment Advantages
01 Single-unit annual production capacity up to approximately 720MW
02 Special large-size, light-load, low thermal expansion, high flatness stainless steel substrate design for HJT high-efficiency cell PVD coating with a large effective coating area
03 Large-capacity, low-fragmentation PVD chamber structure design for HJT high-efficiency cells; strong magnet low-temperature high-sputtering-rate PVD cathode structure design
04 Fast and uniform heating unit design
05 PVD cathode chamber design to reduce film non-uniformity
06 Online PVD high-speed, fast-cycle, high-quality TCO film coating technology
Equipment Display
Basic Information 1. Capacity (pieces/hour) and wafer size*: 17,280 pieces @ G12 half cells; 19,400 pieces @ G12 half cells











