English
SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
Load locking sputtering technology, RF, DC, HiPIMS high-power pulse magnetron sputtering, pulse bias, and other modular combinations. Five substrate trays can be used in the load-lock chamber and automatic lifting and lowering to transfer the substrate, improving productivity. Co-sputtering and Multi-layer deposition using multiple cathodes. Process automatically and record data. It is widely used in R&D and small-scale production of electronic components. Depositing metal film or resistance film on ceramics, glass, and metal can realize deep hole coating, AR 15:1.
Characteristics
6-8inch wafers,G1.0-G5.0 glass substrates(100X100 mm to 1100X1300 mm).
Enables TGV/TCV Via and Surface Metallization (RDL Redistribution).
Supports Aspect Ratios up to 15:1 (AR 15:1).
Flexible Target Configuration for Ti, Cu,Al, ITO, and More to Meet Diverse Process Requirements.
Customized Equipment Solutions Tailored to Substrate Size, Thickness, Throughput, and Routing Needs.
