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SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
The described equipment and process pertain to a high-capacity plasma-enhanced atomic layer deposition system (PEALD) with an automatic wafer handling system and specialized ALD control software. It enables fully automated operation with low precursor consumption and excellent film uniformity and conformality. ALD (Atomic Layer Deposition) is an advanced thin-film deposition technique that allows precise control of film growth on substrate surfaces at the atomic level. By alternating exposure to different chemical vapor precursors, self-limiting surface reactions occur, resulting in layer-by-layer deposition to form thin films. ALD offers significant advantages over traditional deposition techniques, particularly in uniformity of film thickness and coverage of complex-shaped components. It achieves highly uniform coating, even on surfaces with micro or nano-scale structures.
It is widely used in optical lenses, Micro/MiniLEDs, power devices, OLEDs, MEMS, advanced packaging, etc.
Application
Optical: Antireflection film (no ghost or glare), high reflective film (T < 0.1%)， lens protective layer, grating device/ curved surface coating.
Semiconductor: Chip passivation layer, barrier layer, conductive layer, dielectric layer, etc.
Photovoltaic: Passivation layer, transparent conductive layer, water vapor barrier layer, electron transport layer, hole transport layer, etc.
MEMS/Sensor: Insulation layer, diffusion barrier layer, water vapor barrier layer, hydrophobic/hydrophilic layer.
| Substrate type | Wafer | Solar cell or PCB | 3D structural parts |
| Substrate size | 50~300mm | 200×200mm | Φ300×400mm |
| Precursor | Precursors: Liquid, solid, gas, ozone | ||
| Typical processes | Al₂O₃,TiO₂,SiO₂,Ta₂O₅,HfO₂,TiN,AIN,etc. | ||
| Deposition temperature | RT~400℃ | ||
| Non-uniformity | <±1% | ||
| Optional ozone source/plasma source | |||
