English
SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
For advanced HBM/DRAM poly void-free process
UP-DLA systems are used in advanced HBM/DRAM process poly melting annealing to achieve SNC deep groove structure, cavity and defect fixing.
Features
Ultra-high homogenity(>99%)top-hat square laser spot
Flexibly adjusted beam size to achieve annealing By die
High precision visual recognition and alignment compensation
High-precision air floating stage, provides step/scan/single shot annealing
Specifications
| Wafer size | 300mm |
| Annealing temperature | >1400℃ |
| Delay time | 0~1000ns |
