English
SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
For backside ohmic contact annealing for SiC device
UP-SCLA02 systems, with the most advanced 8 inch SiC process, provide accurate positioning and reliable handling for ultra-thin wafers,large-warped wafers, and bonded wafers. Precise oxygen content control chamber solves the by-product problem efficiently.
Features
Flexible UV /green loser wavelength configuration
Compatible with 6/8-inch SiC wafers
Reliable ultra-thin, warped, and bonded wafer handling
Process chamber oxygen content control<10ppm
Specifications
| Wafer size | 150/200mm |
| Wafer thickness | ≥80um |
| Oxygen content control | <10ppm |
| Contact | Ohmic contact |
