English
SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
For Silicon device backside implantation activation
UPLD systems provide precise and reliable transferring for ultra-thin and large-warped wafers, with unique IR annealing technology, deep activation for a thinner and deeper annealing process of IGBT power devices
Features
Reliable handling of ultra-thin and warped wafers
Higher than 90% annealing activation
Unique IR laser to activate deeper than7μm
Specifications
| Wafer size | 150mm/200mm/300mm |
| Wafer thickness |
≥50 μm for Taiko wafer ≥70 μm for Flat wafer |
| Annealing depth | Up to 7μm |
