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SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
HB ORI@300/HB ORI®200 is a wafer hybrid bonding equipment ASSOCIATED developed by SUNFUN MACHINERY. It is used in the production of memory, logic, CIS,3D integrated chips, and Micro-LED.The equipment features units for plasma activation, cleaning, bonding, and measurement, with all performance indicators having reached the level of international counterparts.
Features
● Meet SEMI S2,F47 Standards
● Cleaning Unit
● AVM Unit
● Fully Automated EFEM
● High Precision Alignment
● Edge-Gripper type Debonding
● High Precision Wafer Transfer System
● Face-to-Face Alignment Method
● He Purge
● Low-Temperature Plasma Activation
● Pre-bonding at Room Temperature
Specifications
|
Description |
Specifications |
|
Machine Series |
HB ORIO200/HB ORIO300 |
|
Substrate Diameter |
200mm/300mm |
|
Alignment Accuracy |
≤50nm(3σ) |
|
Bonding Misalignment |
≤200nm(3σ) |
|
Bond Distortion |
≤70nm |
|
Post Litho Residual |
≤50nm(3σ) |
|
Throughput |
≥17WPH |
|
Environmental Control System |
IOS Class 1(partial) |
