English
SUNFUN Group specializes in intelligent and sustainable industrial development. Driving quality advancement in manufacturing across China and the globe through technological innovation, we are committed to creating green value for a better human life.
We have deep expertise in smart energy and smart manufacturing, consistently achieving breakthroughs in precision production. Our capabilities range from 0.001-mm precision machining to the manufacture of components weighing from 0.1 grams to 150 tons. We maintain energy consumption within 0.1% and implement fully intelligent process management—all supported by four decades of specialized experience!
Innovation is the foundation of the growth of our group. We have built an open and collaborative innovation ecosystem, partnering with governments, enterprises, universities, and institutions to enable cooperative innovation and shared value, injecting sustained momentum into the industry.<br/>
As an accredited technology enterprise with its own institute and talent academy, SUNFUN has completed more than ten national-level R&D tasks and undertaken major projects commissioned by agencies such as the NDRC, MOST, and MIIT.
For HBM、AI、HPC、2.5D/3D integration 、3D NAND
The D2W series fully automatic bonding system supports a wide range of possible chip architectures, mainly for high-end applications, including High-Performance Computing(HPC), Artificial Intelligence(AI), High-Bandwidth Memory(HBM), etc, to achieve high-performance chip connectivity, promote the development of 2.5D/3D, Chiplet packaging process.
Features
● Meet SEMI S2, F47 Standards
● Fully Automated EFEM
● High Precision Wafer Transfer System
● Low-Temperature Plasma Activation
● Cleaning Unit
● UV De-bond Unit
● Pre-bonding at Room Temperature
● Ultra-thin Die pickup capability
● High precision bonding Intensity control
● High Precision Alignment
● High Throughput
● AVM Unit
Specifications
|
Description |
Specifications |
|
Substrate Diameter |
200mm/300mm |
|
Substrate Thickness |
350-1500um |
|
Die Thickness |
35-1000um |
|
Bonding Intensity control |
0.1-50N |
|
Alignment Accuracy |
50nm(3σ) |
|
Misalignment |
200nm(Mean+3σ) |
|
Throughput |
2000UPH(Double Head) |
|
Environmental Control System |
ISO Class 1 |
